| 标题 |
Two-phase active immersion cooling for vertically mounted electronics with interchip component-assisted bubble departure |
| 网址 | |
| DOI | |
| 其它 |
期刊:International Communications in Heat and Mass Transfer 作者:Faizan Ejaz; Beomjin Kwon 出版日期:2024-08-28 |
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(2025-6-4)