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Topology Optimization for Embedded Cooling of Multiple and Transient Workloads in 3D Semiconductor Packages |
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期刊:2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 作者:Zekun Wu; Ashwin R Kidambi; Yu-Tao Yang; Chih-Ming Hung; Shurong Tian; et al 出版日期:2025-05-27 |
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(2025-6-4)