| 标题 |
Highly thermoconductive and mechanically robust boron nitride/aramid composite dielectric films from non-covalent interfacial engineering |
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| DOI | |
| 其它 |
期刊:Advanced composites and hybrid materials 作者:Junwen Ren; Guoqing Jiang; Zi Wang; Qiu-Wanyu Qing; Fuli Teng; et al 出版日期:2023-12-30 |
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(2025-6-4)