| 标题 |
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects coupling Multiphysics Full Coupled Model with Optimized Atomic Flux Divergence Simulation |
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| 其它 |
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology 作者:Xueliang Wang; Shuo Feng; T. Luo; Jinyuan Zhang; Yaqian Zhang; et al 出版日期:2025-01-01 |
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(2025-6-4)