| 标题 |
Temperature- and stress-dependent creep behavior of SAC305 solder alloy through tensile characterization and CPFE simulation |
| 网址 | |
| DOI | |
| 其它 |
期刊:Materials & Design 作者:Yuhong Ma; Dan Zhao; Erqiang Liu; Xuexia Yang; Ge-Sheng Xiao; et al 出版日期:2025-09-01 |
| 求助人 | |
| 下载 | 暂无链接,等待应助者上传 |
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(2025-6-4)