| 标题 |
High-frequency 5G substrate: Low dielectric biphenyl polyimide with low CTE and high thermal stability |
| 网址 | |
| DOI | |
| 其它 |
期刊:Materials today advances 作者:Heming Li; Panpeng Wei; Yongqi Wang; Qiushi Zhu; Xinming Wang; et al 出版日期:2024-07-23 |
| 求助人 | |
| 下载 |
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(2025-6-4)