| 标题 |
Thermal creep and fatigue failure of the sintered silver solder in a SiC-IGBT module under power cycling |
| 网址 | |
| DOI | |
| 其它 |
期刊:Engineering Failure Analysis 作者:Xiaoguang Huang; Yichao Wang; Qihui Zhu; Zhongzhe Du; Longchi Zhou; et al 出版日期:2023-09-09 |
| 求助人 | |
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(2025-6-4)