| 标题 |
Effects of Porosity on Thermal Resistance Aging at Submicron Silver Interfaces |
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| DOI | |
| 其它 |
期刊:2023 24th International Conference on Electronic Packaging Technology (ICEPT) 作者:Jian Wang; Mowen Zhang; Chao Yang; Zhiyuan He; Zhiwei Fu; Jia-Yue Yang 出版日期:2023 |
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(2025-6-4)