| 标题 |
Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration |
| 网址 | |
| DOI | |
| 其它 |
期刊:Applied Surface Science 作者:Zhong-Jie Hong; Demin Liu; Hanwen Hu; Chien-Kang Hsiung; Chih-I Cho; et al 出版日期:2022-10-28 |
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(2025-6-4)