| 标题 |
Analytical Assessment of the Effect of Thermal Interface Layer Voids on Temperature in Lid-Integral Microchannel Coldplate Cooling |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology 作者:Chuan Chen; Meiying Su; Rui Ma; Fengze Hou; Liqiang Cao; Jun Li 出版日期:2020 |
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(2025-6-4)