| 标题 |
Improvement Heat Dissipation of Flip Chip Double-Sided Cooling IGBT Module Using AlSiC-Interposer Technology |
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| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology 作者:Guoliao Sun; Cheng Peng; Jing Wen; Hongwei Liu; Wenhui Zhu; et al 出版日期:2024-09-27 |
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(2025-6-4)