| 标题 |
Embedded Microchannel Diamond-Copper Manifold Integrated Heterogeneous Heat Sink for Extreme Thermal Management of Power Electronics |
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| DOI | |
| 其它 |
期刊:2026 27th International Conference on Electronic Packaging Technology (ICEPT) 作者:Yiqian Huang; Siyu Chen; Xinyuan Wang; Yuhao Cao; Ruijie Liu; et al 出版日期:2026-08-01 |
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(2025-6-4)