| 标题 |
FE analysis the effect of bonding wire and solder failure on the resistance and temperature of IGBT |
| 网址 | |
| DOI | |
| 其它 |
期刊:International Conference on Electronic Packaging Technology 作者:Jingyi Zhao; F. Qin; Tong An; Xiaorui Bie; Chao Fang; et al 出版日期:2018-08-01 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)