| 标题 |
Nanocomposites for future electronics device Packaging: A fundamental study of interfacial connecting mechanisms and optimal conditions of silane coupling agents for Polydopamine-Graphene fillers in epoxy polymers |
| 网址 | |
| DOI | |
| 其它 |
期刊:Chemical Engineering Journal 作者:Zhijian Sun; Ryan Wong; Michael Yu; Jiaxiong Li; Mingyue Zhang; et al 出版日期:2022-07-01 |
| 求助人 | |
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(2025-6-4)