| 标题 |
Radial Manifold Microchannel Heat Sink for Electronics Thermal Management |
| 网址 | |
| DOI | |
| 其它 |
期刊:2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 作者:Faramarz Kahbandeh; Mohammad Azarifar; Mehmet Arik; Daniel K. Harris 出版日期:2025-11-19 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)