| 标题 |
Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density |
| 网址 | |
| DOI | |
| 其它 |
期刊:Materials Chemistry and Physics 作者:Chien-Lung Liang; Yung‐Sheng Lin; Chin-Li Kao; David Tarng; Shan-Bo Wang; et al 出版日期:2020-08-13 |
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(2025-6-4)