| 标题 |
Functional Interposer Embedded with Multi-Terminal Si Capacitor for 2.5D/3D Applications Using Planarization and Bumpless Chip-on-Wafer (COW) |
| 网址 | |
| DOI | |
| 其它 |
期刊:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 作者:Yoshiaki Satake; Tatsuya Funaki; Kyosuke Kobinata; Hitoshi Matsuno; Seiji Hidaka; et al 出版日期:2022-05-01 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人或该文件上传人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)