| 标题 |
Prediction of electromigration lifetime of copper pillar bumps in ceramic packaging device |
| 网址 | |
| DOI | |
| 其它 |
期刊:2020 21st International Conference on Electronic Packaging Technology (ICEPT) 作者:Fangzhou Chen; Si Chen; Zhiwei Fu; Yun Huang; Fei Qin; et al 出版日期:2020-08-01 |
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(2025-6-4)