| 标题 |
[高分]
Delamination between dielectric layers of FOPLP due to copper residue under high temperature storage conditions |
| 网址 | |
| DOI | |
| 其它 |
期刊:Electronic Packaging Technology Conference 作者:Yeonseop Yu; J. Ha; Mijin Park; Eunju Yang; Miyang Kim 出版日期:2022-12-07 |
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(2025-6-4)