| 标题 |
Microstructure evolution and mechanical properties of ultrasonically soldered 7075 Al alloy joint with metal foam/Sn composite solder |
| 网址 | |
| DOI | |
| 其它 |
期刊:Welding in The World 作者:Dan Li; Huaqiang Fu; Ling Wang; Chao Wan; Shan Li; et al 出版日期:2022-07-05 |
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(2025-6-4)