| 标题 |
Vacuum-assisted void-free copper filling of high-aspect-ratio through-glass vias for advanced interposers |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Materials Research and Technology 作者:Hyemin An; Sangyeun Park; Yonghyun Kim; Hoyoon Lee; Gayoung Kim; et al 出版日期:2026-08-04 |
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(2025-6-4)