| 标题 |
Interconnection mechanism and strengthening behavior of nano-silver sintered joints for silicon carbide power module packaging: A combined EBSD and nanoindentation study |
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| DOI | |
| 其它 |
期刊:Journal of Materials Research and Technology 作者:Chao Gu; Xiao Hu; Xuyang Yan; Wei Chen; Junwei Chen; et al 出版日期:2025-07-19 |
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(2025-6-4)