| 标题 |
Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses |
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| DOI | |
| 其它 |
期刊:Journal of Materials Science 作者:Dongjin Kim; Sangmin Lee; Chuantong Chen; Seung-Joon Lee; S. Nagao; et al 出版日期:2021-02-25 |
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(2025-6-4)