| 标题 |
Improvement of the resistivity uniformity of 8-inch 4H–SiC wafers by optimizing the thermal field |
| 网址 | |
| DOI | |
| 其它 |
期刊:Vacuum 作者:G. X. Hu; Guanglei Zhong; Xixi Xiong; Huadong Li; Hongyu Shao; et al 出版日期:2024-01-09 |
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(2025-6-4)