| 标题 |
A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Journal of Emerging and Selected Topics in Power Electronics 作者:Haksun Lee; Vanessa Smet; Rao Tummala 出版日期:2019-11-06 |
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(2025-6-4)