| 标题 |
Effect of Molecular Weight of Pressure-sensitive Adhesive to Peeling Phenomenon between Adhesive and Silicon Wafer by Molecular Dynamics Simulations |
| 网址 | |
| DOI |
10.2472/jsms.71.143
doi
|
| 其它 |
期刊:Journal of the Society of Materials Science, Japan 作者:Yuichi IWAKATA; Satoshi IZUMI 出版日期:2022-02-15 |
| 求助人 | |
| 下载 |
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(2025-6-4)