| 标题 |
Effect of temperature and substrate surface roughness on wetting behavior and interfacial structure between Sn–35Bi–1Ag solder and Cu substrate |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of materials science. Materials in electronics 作者:Yu-Long Li; Zhiliang Wang; Xue-Wen Li; Min Lei 出版日期:2020-02-12 |
| 求助人 | |
| 下载 |
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(2025-6-4)