| 标题 |
 A Hybrid Finite Element Analysis–Machine Learning–Generative Artificial Intelligence (Generative Adversarial Networks) Framework for Predicting Reliability Risks in Three-Dimensional Integrated Circuit Packaging |
| 网址 | |
| DOI |
10.1115/1.4071142
doi
|
| 其它 |
期刊：Journal of Electronic Packaging 作者：Unique Rahangdale; Pranali Rahangdale; Shouyi Wang; Yogesh Fulpagare; Dereje Agonafer 出版日期：2026-06-01 |
| 求助人 | |
| 下载 | 求助已完成，仅限求助人或该文件上传人下载。 |
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(2025-6-4)
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