| 标题 |
Test Structures to Study Interconnection Metal/Via/Contact Reliability under Transient Pulse Stresses of ESD and Surge Events |
| 网址 | |
| DOI | |
| 其它 |
期刊:2026 IEEE 38th International Conference on Microelectronic Test Structures (ICMTS) 作者:Pi-Yuan Hsiao; Chia-Tsen Dai; Tung-Yang Chen; Ming-Dou Ker 出版日期:2026 |
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(2025-6-4)