| 标题 |
Study on the adsorption loss of gold during copper precipitation in the hydrometallurgical processing of waste printed circuit boards |
| 网址 | |
| DOI | |
| 其它 |
期刊:Separation and Purification Technology 作者:Qingfeng Ling; Shiwei Zhou; Bo Li; Yonggang Wei; Haigang Dong; et al 出版日期:2026-01-01 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)