| 标题 |
Combining plasma profiling TOFMS with TOF-SIMS depth profiling for microelectronic applications |
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| DOI | |
| 其它 |
期刊:Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena 作者:Agnès Tempez; Sébastien Legendre; Jean-Paul Barnes; Emmanuel Nolot 出版日期:2016-03-09 |
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(2025-6-4)