| 标题 |
Comparative effects of plasma treatments on SiO2 surface and bonding performance for wafer and hybrid bonding |
| 网址 | |
| DOI | |
| 其它 |
期刊:Solid-State Electronics 作者:Sung-Min Park; Sang Hyun Jung; Joong-Heon Kim; Seung Heon Shin; Jaejin Lee 出版日期:2025-12-01 |
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(2025-6-4)