| 标题 |
 An interlayer strategy for co-optimizing contact thermal resistance and thermomechanical stress in hybrid indium/carbon fiber/indium thermal interface materials for large-die packages |
| 网址 | |
| DOI | |
| 其它 |
期刊：International Journal of Heat and Mass Transfer 作者：Jing Wen; Haikun Zhang; Linzheng Fu; Guoliao Sun; Siyuan Lu; et al 出版日期：2026-01-01 |
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