| 标题 |
Thermo-mechanical fatigue life prediction of SiC power device based on finite element simulation |
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| DOI | |
| 其它 |
期刊:International Conference on Electronic Packaging Technology 作者:Dao-Hang Li; Tian-Yi Liu; Wenwen Yi; Wen-Jing Xu; Bo-Wen Zhang; et al 出版日期:2024-08-07 |
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(2025-6-4)