| 标题 |
Effects of stress and temperature gradients on the evolution of void in metal interconnects driven by electric current and mechanical stress |
| 网址 | |
| DOI | |
| 其它 |
期刊:Modelling and Simulation in Materials Science and Engineering 作者:Hua Wang; Zhonghua; Jun Sun 出版日期:2006-04-29 |
| 求助人 | |
| 下载 |
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(2025-6-4)