| 标题 |
Low temperature Cu sinter joining on different metallization substrates and its reliability evaluation with a high current density |
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| DOI | |
| 其它 |
期刊:2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) 作者:Chuantong Chen; Aya Iwaki; Aiji Suetake; Kazuhiko Sugiura; Kiyoshi Kanie; et al 出版日期:2021-05-30 |
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(2025-6-4)