| 标题 |
Thermally Induced Inelastic Deformation and Copper Protrusion Behavior in Cu-Filled Through-Glass Vias |
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| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging, and Manufacturing Technology 作者:Jin-Xu Liu; Bo-Rui Li; Ji-Hua Zhang; Zhen Fang; Zi-Han Wang; et al 出版日期:2026-01-01 |
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(2025-6-4)