| 标题 |
Wafer-Level Integration of Liquid Cooling Microchannel on CMOS Chips with Cu-Cu Low-Temperature Bonding Process |
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| DOI | |
| 其它 |
期刊: 作者:Zhizhen Wang; Dantong Song; Jianfeng Ye; Juan Yu; Jiazheng Wang; et al 出版日期:2025-08-05 |
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(2025-6-4)