| 标题 |
Unlocking the Essence of Lignin: High‐Performance Adhesives That Bond via Thiol‐Catechol Connectivities and Debond on Electrochemical Command |
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| DOI | |
| 其它 |
期刊:Advanced Materials 作者:Keven Walter; Dominik P. Hoch; Leon Hertweck; Kannan Balasubramanian; Jonas Geisler; et al 出版日期:2025-08-15 |
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(2025-6-4)