| 标题 |
Bonding and Failure Mechanisms of Sintered-Silver Die-Attach on Electroless Nickel (Phosphorus) Surface Finish for Packaging Power Electronics Modules |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Transactions on Power Electronics 作者:Meiyu Wang; Haobo Zhang; Weibo Hu; Yunhui Mei; Guo-Quan Lu 出版日期:2024-09-25 |
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(2025-6-4)