| 标题 |
Growth behavior of IMCs layer of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu substrates during aging |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Materials Science: Materials in Electronics 作者:Yulong Li; Zhiliang Wang; Xuewen Li; Xiaowu Hu; Min Lei 出版日期:2018-11-23 |
| 求助人 | |
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(2025-6-4)