| 标题 |
(Digital Presentation) Characterization and Compression Technology of Real 3D Corner Residue Between Dummy Gate and Formed Fin During an Advanced Inductive Coupled Plasma (ICP) Gate Etch Process in Advanced FinFET |
| 网址 | |
| DOI | |
| 其它 |
期刊:ECS Transactions 作者:Xingyu Xiao; Yanliang Wang; Bo Su; Xing Ke; Shiliang Ji; Hai-Yang Zhang 出版日期:2022-05-20 |
| 求助人 | |
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(2025-6-4)