| 标题 |
Cu redistribution layers on permanent glass-core substrates for advanced packaging: Direct-on-glass and polymer build-up architectures |
| 网址 | |
| DOI | |
| 其它 |
期刊:Materials Science in Semiconductor Processing 作者:Suin Chae; Jaemyeong Kang; Seonwoo Kim; Jinho Jo; Da-Yeong Lee; et al 出版日期:2027-01-01 |
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(2025-6-4)