| 标题 |
Simulation of the Dynamic Process and Quality-Influencing Mechanisms in Wafer-to-Wafer Hybrid Bonding |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology 作者:Yang Xi; Shizhao Wang; Zhiqiang Tian; Shi Zhang; Fang Dong; et al 出版日期:2026-02-10 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)