| 标题 |
Research on the reliability of Micro LED high-density solder joints under thermal cycling conditions |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Physics: Conference Series 作者:Mingyang Liu; Junyang Nie; Yifeng Liu; Jie Sun; Min Li; et al 出版日期:2022-05-01 |
| 求助人 | |
| 下载 |
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(2025-6-4)