| 标题 |
Heterogenous Package Stress Modeling Using Polynomial Deep Regression with Latin Hypercube Sampling and Factorial Analysis |
| 网址 | |
| DOI | |
| 其它 |
期刊:2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) 作者:Kart Leong Lim; Ji Lin 出版日期:2024 |
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(2025-6-4)