Lv21
198 积分 2025-12-29 加入
Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review
1个月前
已完结
A Deep Learning Approach for Reflow Profile Prediction
6个月前
已关闭
Heterogenous Package Stress Modeling Using Polynomial Deep Regression with Latin Hypercube Sampling and Factorial Analysis
6个月前
已关闭
Thermal resistance prediction model for IC packaging optimization and design cycle reduction
6个月前
已关闭
The design of a voltage conversion SIP based on electrothermal coupling method
6个月前
已关闭
Combined Modeling of Electromigration, Thermal and Stress Migration in AC Interconnect Lines
7个月前
已完结
Research Progress on the Surface/Interface Reaction Mechanism of Metal/Dielectric Heterogeneous Materials in Hybrid Bonding
7个月前
已完结
Inverse Hybrid Bonding for D2D/D2W Heterogeneous Integration with 20 μm Pitch
7个月前
已完结
Non-wet Simulation and risk prediction of 2.5D Package
7个月前
已完结
Advanced Numerical Modeling of Microstructure Effect on Fine Cu Redistribution Lines Under Electric Current Stressing
7个月前
已完结
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