| 标题 |
Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments |
| 网址 | |
| DOI | |
| 其它 |
期刊:Soldering & Surface Mount Technology 作者:Guang Zeng; Songbai Xue; Liang Zhang; Zhong Sheng; Lili Gao 出版日期:2010-09-21 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人或该文件上传人下载。 |
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(2025-6-4)