| 标题 |
A novel mechanical degradation mechanism in Ag nanopaste/Au pad interface: Grain boundary diffusion-induced Kirkendall-like voids |
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| DOI | |
| 其它 |
期刊:Journal of Materials Science & Technology 作者:Yi-Ping Wang; Jia-Yun Feng; Zi-Rui Tong; Peng Wu; Runze Wang; et al 出版日期:2026-01-01 |
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(2025-6-4)