| 标题 |
High-Density 3D Multi-Layer Via Capacitors Based on Silicon Oxide Dielectric with Ultra-Low Parasitic Parameters for Advanced ICs |
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| DOI | |
| 其它 |
期刊:International Conference on Electronic Packaging Technology 作者:Wen-Ting Liang; Jian-Ming Zhong; Chong-Yi Chen; Zhi-Hao Chen; Hao-Yang Peng; et al 出版日期:2026-08-01 |
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(2025-6-4)